Electronics Forum | Fri Apr 11 01:01:41 EDT 2003 | kadaba
we are evaluating mirae1025 pick and place machine along with mydata tp9-2u samsung cp45lv has any one got info on mirae and how do you rate this against the other two.. or alternatively should i include anu other similer model. i amd having not muc
Electronics Forum | Sun Apr 13 19:50:20 EDT 2003 | yukim
Hi, We are placing (+) & (-) terminals in SMT. We have just changed the plating of them: from Nickel to Tin (Sn). During the trial, we used the same reflow profile as before changing, and the solder seems different: a bit cold, with some solder paste
Electronics Forum | Tue Apr 15 14:56:53 EDT 2003 | blnorman
I know when I worked on a NASA site, anyone in the lab was given a free physical once a year. This way they could find out what employees were normally exposed to and could track any potential illnesses. What are the costs of a lawsuit when an empl
Electronics Forum | Wed Apr 23 11:50:42 EDT 2003 | joseluis_amper
Anyone could help me about what it's the best enviroment conditions (humidyti, temperature, antistatics...)for a new emplacement in a new factory? Now, we are moving to a new place, like a very big factory, and I try to adapter the best enviroment co
Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris
Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w
Electronics Forum | Thu Aug 28 20:24:30 EDT 2003 | yukim
Hi, do you know how much the problem can be reduced by using anti-tombstoning solder paste? I tried two different lots using same solder paste (containing Ag). With one we did not see any improvement and with the other one, a lot. So, I am not quite
Electronics Forum | Mon Apr 28 11:23:42 EDT 2003 | David
Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gol
Electronics Forum | Tue Apr 29 03:29:01 EDT 2003 | chrissieneale
Does anyone have any figures on visual fail / no pick? our machine records this but no one has been recording the machine and it's been running since we've had it (a good few years). I am currently assuming it's about 0.2/0.3% but this is a (not very
Electronics Forum | Thu May 01 18:37:31 EDT 2003 | gregoryyork
Did you get any dulling of the solder joints at all or importantly was the resist discoloured or bleached after cleaning. It is possible to absorb flux and saponifier into the resist and this will definately cause poor SIR or electromigration especia
Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner
To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can
