Electronics Forum | Wed Jan 31 09:44:26 EST 2001 | BLNorman
I listed this under design, but got no responses, so I'll try this forum. Our current solder paste vendor wants us to evaluate a paste. One of the selling points is that this paste (SnPb) will have the same flux package that will be used with some o
Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
Electronics Forum | Tue Feb 13 14:59:48 EST 2001 | vargas_s
I have an application where a customer cannot get a 14 lead TSSOP device in time for his needs (his board design is fixed). He can however get the same device in a 16 lead SOIC wide body package (two leads are not used). Has anyone come across a cost
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette
To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive
Electronics Forum | Fri Mar 02 12:46:32 EST 2001 | billschreiber
Hi Dale, Care should be taken when using compressed air to dry a stencil. Just as high-pressure sprays can bend delicate land mass areas between fine-pitch apertures, so can high-pressure air. In addition, OSHA frowns on the use of high-pressuer a
Electronics Forum | Thu Feb 22 09:56:21 EST 2001 | blnorman
An adhesive, is an adhesive, is an adhesive. Yes most will thin when exposed to elevated temperature, but that's only for a short time. As cross-linking starts, viscosity increases. Having made countless numbers of adhesively bonded samples in the
Electronics Forum | Thu Mar 15 16:41:46 EST 2001 | jollyrodger
You guys are absolutely correct, and i thank you for your invaluable advice. I would like to know if there is any online manuals for the equipment i stated b4. I have tried so hard to find these with little results. However i did get onto th
Electronics Forum | Thu Feb 22 13:11:51 EST 2001 | keithtbe
Silver epoxy is used to joint the LED beam lead and the trace of the flexi circuit. Due to the LED mounted skew upward or downward unconsistently, the strength of the joint weakened and causing the LED lights up intermittently. I would like to ask fo
Electronics Forum | Fri Mar 02 09:50:04 EST 2001 | stefwitt
Dave, I did assume Angela meant components ready for pick up. It would be too time consuming for any machine to measure the component availability prior to pick up. If we assume that the feeder advances in a rate of six sigma ( 3 defects per mio ) t
