Electronics Forum | Thu Apr 27 08:42:22 EDT 2017 | pvasquez
Hello M. We are a low volume high mix manufacturer with a total of 7 Mirtec AOI machines including a new MV-6 OMNI 3D system. I am very pleased with this machine! When we did our 3D AOI research, my team narrowed the field down to 2 vendors, Mirt
Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle
We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/
Electronics Forum | Mon Apr 16 20:53:56 EDT 2007 | davef
Tell us about: * Temperatures and times of the thermal profile * Where the thermocouples were mounted * Materials involved * Where in the process the 672 BGA component is soldered * Processes that follow that soldering
Electronics Forum | Thu Apr 27 05:45:20 EDT 2017 | pavel_murtishev
methos1979, 1. Mirtec, Marantz 2. Koh Young, Orbotech, Mirtec 3. Koh Young Zenith 4. Definitely Programs for 3D AOI are prepared really faster. Having defined component database, programming takes no more than a couple of hours. Fine tuning takes u
Electronics Forum | Thu Dec 29 22:53:14 EST 2022 | davef
Look in the Express Newsletter [https://smtnet.com/express/] dated December 29, 2022 for some papers on "head in pillow"
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
Electronics Forum | Fri Nov 22 11:31:52 EST 2013 | igorfo
Hi I aa QE on SMT line that produce products for Home introduction. No so long ago we have a problem with soldering of BGA Head on Pillow (root cause mismatching customer requirements and BGA profile spec, suplier change %Ag) and our product affect
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Fri Nov 22 16:55:30 EST 2013 | hegemon
Head and Pillow defects beneath a BGA are difficult to find, no matter what the equipment is on hand. Since you do not appear to have access to tools that would help you, or $$ to purchase said tools, I might recommend that you use an outside source
Electronics Forum | Wed Dec 21 11:33:22 EST 2022 | SMTA-64304420
Does anyone have experience with HiP defects with DDR memory components that they would be willing to share? I am interested in SMT process corrective actions and repair processes. I can discuss this privately if needed.
