Electronics Forum | Mon Apr 25 16:25:07 EDT 2005 | Mike Konrad
Hi Carl / Bill, I seem to miss your point regarding disclosure. As I CLEARLY stated, it is the perception of damage more than the possibility of damage. As a twenty year veteran of de-fluxing systems, I can assure you that there remains enough con
Electronics Forum | Mon May 09 10:52:29 EDT 2005 | patrickbruneel
Hannu, First and for all I have a problem with your question "tried and trusted" for the simple reason that you are going to change too lead-free. Ultrasonic soldering or welding is not new, as far as I know it is only used applying the ultrasonic
Electronics Forum | Thu Jun 16 10:30:35 EDT 2005 | clampron
Good Morning Everyone, We have had an issue with a specific board house on a job that has bright tin plating. At one point, a lot recieved proved to be unsolderable. The plating looked OK but no wetting would occur at reflow. We hagled with the boar
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Sat Jul 16 08:12:44 EDT 2005 | davef
skandaae: By "tilt" do you mean that one end of the 0603 has lifted from the board surface? If so, we call this "tombstone". In general, tombstoning is caused by an imbalance in temperature or forces on the component. * Convince yourself about the
Electronics Forum | Thu Jul 14 20:16:33 EDT 2005 | Bman
I know what the COB process is, and I have no intention of getting involved with that end of things. I need to know how to place SMT parts on a board with a COB. It looks like the preferred method is to place the SMT parts first, then go through th
Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base
Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot
Electronics Forum | Tue Aug 16 00:27:12 EDT 2005 | Peter
Hello, I have a question on white residues formation at wave soldering. We have recently run experiments to test the performance of various halide-free water soluble fluxes (ORH0 under JSTD-004). The flux was applied through a spray fluxer and all P
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
