Electronics Forum | Thu Aug 28 12:25:11 EDT 2014 | tombstonesmt
http://www.nortec.co.il/image/users/82719/ftp/my_files/catalog/auto-apply%20for%20web.pdf?id=12457655
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
Electronics Forum | Tue Mar 25 11:25:18 EDT 2014 | horchak
The first impression I get is that the mask was applied over dirty or contaminated copper. What is the trace and land finish on the PCB? You also appear to have a wetting problem.
Electronics Forum | Tue Aug 26 17:50:52 EDT 2014 | dkrawchuk
Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company th
Electronics Forum | Tue Nov 04 15:42:22 EST 2014 | rdubya
break-out the old toaster oven! apply solder paste to board place part and re-flow in toaster oven. those things re good for more than just pot pies and toaster strudel.
Electronics Forum | Tue Mar 03 03:31:07 EST 2015 | vb7007
Hi We are trying to Solder LCD Flex to PCB. Few suggested Z-Axis Film (Conductive tape) which can be stuck between Flex-PCB and bonding by applying hot soldering iron across the flex. Is this effective method. If there is any other option, please su
Electronics Forum | Tue Sep 08 16:35:17 EDT 2015 | duso02
There are many liquid masking manufacturers. Some even use acrylic vice latex. Try Contronic Devices. They make their mask in multiple viscosities depending on how you will apply it and where.
Electronics Forum | Thu Mar 19 11:04:28 EDT 2015 | eliran
Hi, I need to replace a LGA component from assembled boards. What are the best methods (automated ones preferred) for this process? The main issue is how to apply solder paste for the fine pitch (0.4mm) on assembled board. Thanks, Eliran Ave
Electronics Forum | Thu Mar 19 11:31:14 EDT 2015 | duchoang
We remove the LGA, clean the pads, "re-ball" the LGA by solder-printing it, reflow and re-install it on board as BGA. That way, we don't need to apply solder paste on board. It works !!!
Electronics Forum | Fri Mar 20 21:07:27 EDT 2015 | gabinocf
Thanks by the information provided for you. How can we prevent the Dendritic Growth, exist some table where i can see the quantity of flux that i can apply to the PCB. Thank You.
