Electronics Forum: approach (Page 1 of 68)

Conformal Coat Masking

Electronics Forum | Thu Jul 25 10:52:26 EDT 2002 | waynesmith

I've been tasked with increasing the CCA throughput in our Conformal Coating workcenter. My first approach will be to look into a more *automated* approach for the masking process. We currently use a manual method of using masking tape prior to con

Re: RF surface mount assembly

Electronics Forum | Thu Sep 21 12:10:16 EDT 2000 | Boca

On the money as usual! (Your subtle approach is something to behold. Much like my approach, which has gotten me into more grief over the years than I should be allowed to have.) Boca

reflow / soldering temperature

Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef

I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.

Coin Cell Battery

Electronics Forum | Wed Aug 14 21:13:30 EDT 2002 | davef

Insulating tab approach, like: * Go to page 5 of http://www.kalatel.com/lit-rack/install-man/kts_253_253-16_man.pdf * http://support.tandy.com/support_radios/doc64/64039.htm * Go to �Fixing�, Step 6 of http://www.sunvic.co.uk/TLX%20Digital%20Room%2

ESD concerns

Electronics Forum | Wed Oct 18 19:52:09 EDT 2006 | davef

Ted Dangelmayer's book [ESD Program Management: A Realistic Approach to Continuous Measurable Improvement in Static Control; Dangelmayer, T; Kluwer Academic Pub 1999 e2; 0412136716] is excellent. Often, ESD supplies sales-types use the "Chicken Littl

Ready, Shoot, Aim!!!!

Electronics Forum | Fri Mar 16 08:26:01 EST 2001 | Robert J. Latino

Dear David, Like Mr. Robert Nelms, I must be included in the "anal" consultants category. While I understand your frustration and dissatisfaction with whatever approach you were using, there is progress being made out there. The "right" consulta

BGA Solder Mask Repair

Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef

You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the

Stencil thickness

Electronics Forum | Thu Mar 02 18:15:23 EST 2006 | Dirka Jihabi

I disagree with the homeplate approach.

part orientation

Electronics Forum | Thu Jun 26 21:14:14 EDT 2008 | davef

Lots of times the suppliers define pin on with a mark on the part molding. Often, they define their approach on their data sheet.

Stencil maintenance approaches

Electronics Forum | Thu Sep 09 15:54:31 EDT 2021 | majdi4

how thick is the stencil to measure? in µm , 29 µm ?

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