Electronics Forum | Thu Feb 25 18:06:04 EST 1999 | Chris Lampron
| No salesmen please. (I didn't use my real email address) | | I would like to know if anyone is using either of these SMT machines and if they are what input can you give me on them. We are looking at the Contact 3Z and the Multitroniks DHM for o
Electronics Forum | Wed Jan 20 20:29:17 EST 1999 | Tony A
| | Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge hole
Electronics Forum | Mon Sep 14 16:44:37 EDT 1998 | Steve A
| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for C
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Jul 27 08:42:13 EDT 1998 | Justin Medernach
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Fri Jul 10 08:53:28 EDT 1998 | justin medernach
| I am eager to hear from anyone who has experience with X-RAY inspection equipment (specifically for BGA devices) or can make any recommendations. Any knowledge of second hand equipment for sale would also be valuable. | Regards | Rob Rob, Glenbrook
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Wed Feb 13 09:49:30 EST 2002 | Phil the Quality Guy
Basically, the charge curve of a nicad cell isn't particularly linear. Your length of time is more dependant on the amperage rating of your cell. There's a difference between a 1.4 Amp and a 2.2 Amp capacity. As a nicad charges the bulk of the cha
