Electronics Forum | Thu May 17 21:50:29 EDT 2007 | jeremyl
Hi All. We are a tiny startup company developing an IC in a flip-chip CSP package. We find ourselves in need of being able to remove and replace (ie rework) our chip on a characterization board. The board will not be big and the chip is very small
Electronics Forum | Tue May 13 20:48:10 EDT 2008 | davef
Rob On your thermal recipe: Above liquidous for nearly 2 minutes seems to be a scoush long. Not sure you're doing anything positive with things like that. On the article: * SMT Magazine, October, 2002, p24 'Q & A: BGA Dewetting' * "Q: Our manufactu
Electronics Forum | Thu May 29 00:26:58 EDT 2008 | bobwillis
Bob Willis' Top Ten Reference Books Here is a new list of "Bob Willis' Top Ten" reference books that has been updated for 2007 to take into account recent changes in technology. In the publishing industry there are many charts and awards for the bes
Electronics Forum | Thu Sep 18 17:52:49 EDT 2008 | mi
Mydata has Utility menu to "export" panel, layout, into a file, etc. And we have an Excel macro that converts all the data in this file into rows of records for each components; and save this to MSDOS csv file format giving: X,Y,Z,P/N, reference de
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Wed Jul 14 13:41:40 EDT 2010 | rway
We are running SMT products and have been for some time now. First, I wanted to check with you folks to see what an acceptable FPY rate, or what you would consider and acceptable rate, is. Secondly, we are having issues primarily with product that
Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm
It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen
Electronics Forum | Fri Mar 04 19:38:44 EST 2011 | olddog
We are a very small (2 people) company and have recently purchased a used Quad 4c Mk II, for our low-volume in-house production. The machine appears to work perfectly for our needs. My question is regarding programming from a concept standpoint. Our
Electronics Forum | Thu Apr 07 09:24:47 EDT 2011 | rway
What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the pa
Electronics Forum | Fri Nov 25 15:52:40 EST 2011 | davef
"IPC-2221 - Generic Standard On Printed Board Design" talks to fiducials. Anther take on fiducials says they shall meet the following requirements. * Make fiducials 1 - 1.5 mm diameter circle. * Cover fiducials with tin. * Keep solder mask opening at
