Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
Electronics Forum | Wed Jul 09 18:36:08 EDT 2008 | jmelson
Just to clarify, I tried to read a summary of the Oko institute report, but it was in some word processor format I wasn't quite compatible with. But, I did get some of it. It appeared to restrict ANY use of nickel (couldn't tell if that was in allo
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
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