Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F
From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch
Electronics Forum | Tue May 30 08:24:23 EDT 2000 | David Lazarus
Could some of you give me ideas where I could find articles or studies about market or player performance in the SMT/through hole industry (specifically, OEM's for the automotive industry)? I am part of design team for a scholastic design project at
Electronics Forum | Wed May 17 21:13:00 EDT 2000 | Dave F
Earl: Two things: 1 You know that I read your articles, because I asked you questions about them and e-mailed you a drawing of a layer stack. 2 You certainly rose to JAXs bait. I believe he may have set the container on the table, while removing
Electronics Forum | Fri May 12 05:47:18 EDT 2000 | Wolfgang Busko
Just another thing to look at: Look in the archives of IPCs technet. There I found this interesting this interesting link http://www.plexus.com/In_The_News/Papers/papers.html and an interesting article (in PDF format) about "tombstoning of 0402's a
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Wed Mar 22 15:41:00 EST 2000 | MARK RAHLF
Does anyone have any information on inhouse recovery systems for the removal of lead from the dross. There was an article in the march issue of SMT magazine. The web site it directed me to go to is not the correct web site. If anyone has any informat
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Wed Jan 17 20:33:19 EST 2001 | davef
The corner balls are supposed to collapse, but at roughly the same time as the other balls collapse. Also, those balls are located in the place that isthe easiest to get hot. Think about cranking-up the bottom heat, waiting, and slowing down the pr
Electronics Forum | Wed Mar 28 17:25:58 EST 2001 | davef
Just got off the phone after bustin' my brother-in-law about the article in USA Today about all the goofy time zones in the US state of Indiana. Then I saw: * SMTnet Forum time is about a half hour late * SMTnet time on this message I'm posting on
Electronics Forum | Wed Jul 25 09:08:19 EDT 2001 | caldon
Our July 2000 empfasis article has a residue topic available for down load. http://www.empf.org (look under empfasis). Also, there are tons of Tech Pubs information available for down load via our web site as well. Caldon W. Driscoll ACI USA 610-36
