Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Fri Jun 18 13:47:33 EDT 1999 | Jason Gregory
| Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave review
Electronics Forum | Fri Jun 18 14:07:50 EDT 1999 | Earl Moon
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Thu Apr 29 17:18:29 EDT 1999 | JohnW
| | | Anyone using hot air nife for wave soldering process. | | | Does it work? | | | Does it really eliminate solder bridging and does it create any other problems? | | | | | | any feed back will be much appriciated. | | | | | | Thanks | | | |
Electronics Forum | Wed Feb 03 16:38:19 EST 1999 | Steve Gregory
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker
Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan
Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti
