Electronics Forum: asm wire bonder (Page 1 of 3)

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg

Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

gold wire bonding

Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui

Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your

gold wire bonding

Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow

Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w

gold wire bonding

Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris

The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

ASM Bonder

Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens

I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI

We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe

Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure

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