Electronics Forum: aspect and ratio (Page 1 of 19)

Re: aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup

Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.

Re: aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup

Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.

aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson

I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?

PCB Thickness and BLR

Electronics Forum | Wed Jul 24 09:54:49 EDT 2019 | amitthepcbguy

Typically, the reliability of PCBs suffers significantly due to the increase in aspect ratio. It is not preferred to opt for high thickness boards. However, I would like to point out that your assumption seems to be wrong as board layers do not direc

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef

Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F

Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Stencil Aperture Aspect Ratio

Electronics Forum | Tue Jun 17 02:08:53 EDT 2003 | Bruce

What is the correct formula for Aspect Ratio? Thanks

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