Electronics Forum: aspect and ratio and problem (Page 1 of 2)

PCB Thickness and BLR

Electronics Forum | Wed Jul 24 09:54:49 EDT 2019 | amitthepcbguy

Typically, the reliability of PCBs suffers significantly due to the increase in aspect ratio. It is not preferred to opt for high thickness boards. However, I would like to point out that your assumption seems to be wrong as board layers do not direc

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Re: No clean and f devices

Electronics Forum | Thu Nov 11 18:28:10 EST 1999 | John Thorup

Hi Jeff Actually it's not necessarily Signal to Noise Ratio or even RF circuitry. All no cleans leave behind residue by description. This residue can affect RF or other high frequency circuits in a number of different ways including SNR. Very high

Help! Samsung CP45 and CP63 Problems

Electronics Forum | Tue Oct 11 18:35:59 EDT 2005 | stepheniii

How big a tank do you have at the compressor? Basically the bigger the better. You will still have the same duty cycle ratio but the compressor won't be cycling as fast. Hopefully someone here knows what a good size would be. And when you say "kic

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef

Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.

Neoden and YX chinese pick and place machines, looking for users opinions

Electronics Forum | Mon Feb 22 20:31:32 EST 2021 | marcelorotofrance

Hey there I'm starting this thread to get opinions and comments from legit users of today's chinese pick and place machines, like Neoden K1830 and YX's SMT550/660/880 My intention is to take into account those sincere and honest opinions, to put asid

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F

Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2

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