Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Thu Feb 01 17:34:45 EST 2018 | Mike Konrad
Thanks for the kind words Dave. At no point in my reply was I trying to sell anything. I apologize to anyone who believes otherwise. I agree with the poster, if assemblies are going to be cleaned, consider a flux designed to be cleaned. While this is
Electronics Forum | Thu Jun 07 13:40:25 EDT 2018 | vetteboy86
Could anyone recommend a lab to send a few assemblies to for evaluation of foreign substance? We had a few assemblies that are conformal coated come back from a customer claiming their is corrosion from water exposure. After evaluation I do not beli
Electronics Forum | Wed Aug 07 04:50:37 EDT 2019 | orbitcoms
Would anyone have a link to a site or a book suggestion for creating assembly documentation. I am not looking for ISO 9X or anything just some ways I can document the process for assembly of products at the board level. Most of my experience was in R
Electronics Forum | Thu Aug 08 07:19:52 EDT 2019 | SMTA-Joe
We do this often. Including fences with many internal structures. I assume you are hand soldering the fences. Are you heating the assembly during the soldering process? We typically have no issues with this operation, on a variety of assembly typ
Electronics Forum | Wed Jun 24 18:50:31 EDT 2020 | premkumar_haribabu
Dear experts, We are in stage to fix lapse or hold time between pre-bake to reflow process ( SMT ) for flex-rigid PCB, usually for flex pcb , we need to assemble as early as possible once after baking & if not , we can store in humidifier up to some
Electronics Forum | Sun Nov 19 22:24:38 EST 2000 | qinongzhu
I am finding a SMT assembly system for photoping/R&D application. Who can give me some information about suppliers ? thanks
Electronics Forum | Wed Nov 08 17:01:17 EST 2000 | pallen
I know there must be a specification for this but I don't know what it is. What is the maximum psi setting for an air line that is used to dry assemblies off an aqueous cleaner? The assemblies are fixed but predominately SMT with many 0602/QFP/BGA co
Electronics Forum | Tue Oct 03 20:32:27 EDT 2000 | Dave F
IPC-1720 Assembly Qualification Profile Developed by the OEM council of the IPC, IPC-1720 categorized an electronic assembly manufacturer's capabilities and supplies the OEM customer with detailed, substantive information.
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
