Electronics Forum: assemble/ (Page 196 of 598)

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 16 21:27:56 EST 2001 | davef

No we do not use such a storage unit. We say our preferred environment is within: * 30%RH / 84�F * 30%RH / 72�F * 70%RH / 78�F * 70%RH / 68�F J-001C says [words to the effect of]: * At 30%RH and below you�d better make sure your ESD control program

Laser trimming of resistors on PCB

Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef

You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [

Pallet Maintenance

Electronics Forum | Tue Mar 13 13:15:59 EST 2001 | kerryn

Dear Dave and Mike, I do not normally respond to threads of the forum. However, I do enjoy reading other's comments. There is a lot of valuable information provided by both suppliers and users. You seem to be making light of Bill Schreiber's com

Wavesoldering

Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef

I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t

SMT Rework

Electronics Forum | Mon May 21 17:35:37 EDT 2001 | davef

We agree with LarryK, the previous poster. We know of no such ISO document, either. ISO can be found at: http://www.iso.ch/iso/en/ISOOnline.openerpage. ISO should be able confirm our thinking. Continuing: (1) Please get back to us if you find s

BGA Assembly Misalignment

Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef

BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr

Lead Free Process

Electronics Forum | Tue Jun 26 22:52:27 EDT 2001 | ianchan

I second that juicy bit from brownsj, Sn96/Ag4 process is what we are using too, currently for BIB runs, dunno about current capital investments needs, coz from what I understand, our company's BIB pioneer guy, personally designed the machines in cur

Inspection Methods

Electronics Forum | Wed Jul 25 13:39:12 EDT 2001 | loriannplummer

I have been re-evaluating the way we do our visual inspection process due to its apparent ineffectiveness. We recently tested this by introducing 6 obvious defects on one assembly and gave it to one of our "esperienced" visual inspection operators. 2

Inspection Methods

Electronics Forum | Wed Jul 25 13:43:53 EDT 2001 | loriannplummer

I have been re-evaluating the way we do our visual inspection processes due to its apparent ineffectiveness. We recently tested this theory by introducing 6 obvious defects on one assembly and gave it to one of our "experienced" visual inspection ope

Immersion Silver PCB Surface Plating

Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren

We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the


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