Electronics Forum | Thu Jul 20 15:02:31 EDT 2000 | Mike McMonagle
Bob, Could you outline the processes used for this seemingly impossible assembly technique? Whenever mentioned, most folks shake their heads and look at me like I'm delusional (not true since I started my new medication, hehehe). Of course they're th
Electronics Forum | Thu Jul 20 12:36:04 EDT 2000 | Mike McMonagle
The EU recently announced that the WEEE directive proposal for lead-free assembly in Europe has been adopted, but the implementation date has been moved from 2004 to 2008. What do you feel was the driving force behind this change, and do you feel tha
Electronics Forum | Thu Jul 20 12:59:52 EDT 2000 | Mike McMonagle
Bob, I attended your PIHR workshop at Nepcon a few years back. At the risk of making a shameless plug, I must say that the presentation and the materials used were some of the best I have seen in my many (20+) years in the industry. The video that is
Electronics Forum | Thu Jun 22 16:01:45 EDT 2000 | Dave F
Lee: How do the folks over in Europe determine that the lead used in electronic assemble is a hazard? What do they do with their electronic products that gets the lead in to their bodies? Without contesting that lead is a hazard, how do people co
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Wed May 09 10:39:03 EDT 2001 | davef
The two first level cuts at comparing placement machines are: * Placement rate * Range of component capabilities This boils-down approximately to machine price. Virtually, everyone's feeders are priced similarly. Go to "Circuits Assembly" magazine
Electronics Forum | Thu May 24 19:19:20 EDT 2001 | davef
Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4
Electronics Forum | Thu Jun 14 10:50:49 EDT 2001 | slthomas
I must be missing something.....why can't you simply attach thermocouples, profile the assembly, and adjust your zones as required to reach the parameters required by your paste and component specifications? Is there a restriction on that process fo
Electronics Forum | Fri Jun 15 09:59:29 EDT 2001 | brownsj
We have recently had an incident where we feel that we have received a batch of cards from our assembly house which have by-passed their ICT operation. This has been determined by the lack of any indentations on the test pads from the sprung probes.
Electronics Forum | Wed Jun 20 16:03:01 EDT 2001 | Gil Zweig
The multi-layer printed circuit board manufacturers have been using x-ray inspection for many years to quality control drilling and lamination of multi-layers. Assemblers should consider using x-ray for incoming quality control from their multi-layer
