Electronics Forum: assemble/ (Page 36 of 598)

Lead Free Prep.

Electronics Forum | Wed Jun 11 13:11:33 EDT 2008 | namruht

We are currently completely building lead based assemblies. We are going to start doing our homework based on Management request. I have a pretty strange question that I was asked but really did not have an answer to. Can a Lead-Free assembly have a

Box Build/ Wiring/ Terminal Blocks Assembly Drawings???

Electronics Forum | Thu Jul 24 15:00:19 EDT 2008 | scooter

I use Publisher to create work instruction with pictures and text boxes containing the part numbers and descriptions of the parts for that assembly . Then use arrows to show their location on the picture If the assembly is complex you might need to

QFP PACKAGE MANUAL SOLDERING

Electronics Forum | Thu Oct 02 05:07:59 EDT 2008 | arebom

If you have coplanarity issues on components that have not been assembled yet, check out an equipment that will help you resolve the lead coplanarity problem before you load them in your assembly equipment; I know that Fancort sells an equipment for

Latent shorts on QFN package

Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint

I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Mon Aug 31 12:37:39 EDT 2009 | rocko

Hi All, As a result of equipment damage I have a problem with a cleanliness of printed circuit assemblies. One whole production batch was polluted by ionic residues because a large amount of hard water had been penetrated in the water-supply system

Cleaning assembled circuit boards?

Electronics Forum | Wed May 19 19:46:41 EDT 2010 | jry74

I am experiencing sporatic de-wettting issues, so I have been thinking about ways to clean fully assembled circuit boards that have open switches, contacts, etc. I also suspect that that plastic bodied components have residual silicone mold release

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 05:09:27 EDT 2010 | grahamcooper22

Dear SMT Manufacturer, I am wondering if the device could have so much moisture in it and storing it in a dry cabinet isn't going to remove it all. As a final test to see if moisture in the device is causing the voids/solder balls then I'd bake it a

Assembling one side SMT one side TH

Electronics Forum | Sat Aug 13 10:56:57 EDT 2011 | jldowsey

Process Flow #4 in davef's response is your best bet for this assemblly judging buy your pictures. We purchase our selective wave solder pallets from Ascentec Engineering - they can fabricate a pallet to hold your assemblies, keep the SMT devices pro

Ficiduals, Best Practice

Electronics Forum | Tue Sep 13 12:00:57 EDT 2011 | swag

Flex circuits are assemblies that can be bent or twisted into shapes after assembly (flexible). When heald in panels for SMT assembly, it's difficult to get repeated x/y offsets so you need to consider fiducal placement in your design for placment m

Assembleon Topaz X

Electronics Forum | Mon Oct 08 05:48:36 EDT 2012 | vinitverma

Dear Chris, N2324 and N2325 are for nozzle down sensors. THese sensors are located on the left and right side of the left and right walls of the head assembly respectively. There are very small holes in the walles through which these sensors transmi


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