Electronics Forum | Thu May 07 10:09:24 EDT 1998 | Cunli Jia @ SMTnet
| I thought this was a forum for equipment only. We were asked to take OUR messages off of the other SMTNet forum. I see many messages concerning process related issues that don't have anything to do about buying, selling or servicing SMT equipment
Electronics Forum | Wed Jan 21 03:44:04 EST 1998 | Igmar
| We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested
Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo
Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil
Electronics Forum | Tue Aug 28 16:44:27 EDT 2001 | davef
Several points are: * Some may argue that DPMO is peculiar and specific. That�s why IPC-7912 states �Users of this document are cautioned when comparing one manufacturer�s indices to one another due to differences in assembly complexity and the amou
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Fri Nov 30 17:33:12 EST 2001 | slthomas
After saying for years that we'd never do two-sided assembly, the powers that be are not only saying we will, but they're threatening to throw an out of house design at us...no frame (it's a PCI card with a couple of dinky breakaway tabs), no tooling
Electronics Forum | Sun Jul 28 19:50:55 EDT 2002 | fastek
Wrong Sai. Quite a difference between assembling a board or a PC and building/assembling a screen printer. These systems being built in China will be for the China or Asian market only. MPM and DEK spent decades trying to establish themselves as the
