Electronics Forum | Fri Jul 21 10:04:07 EDT 2006 | russ
Well, normally this is from a misplace for some reason and the part is bouncing around the PCB, it should have been on some pads somewhere, Do you know if this assembly also had "missing" parts? Could be temp loss of vacuum during xy seek and part f
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Thu Aug 17 23:24:34 EDT 2006 | guest
I suggest you do the ff prior the machines arrival at your site. - Get all the dimensions of purchased machines from their catalogue. - Lay out / draw their footprints in the manufacturing floor. - Drop down air and power supply. Unpacking, level
Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby
Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha
Electronics Forum | Fri Aug 25 07:38:12 EDT 2006 | CL
Hi CP, I used to work for a flex circuit manufacturer. I am at a CM now and am we have started building RoHS production status assemblies. I personally think flex circuits will have a difficult time with the required temps for RoHS. I spoke to someo
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Thu Aug 24 12:53:56 EDT 2006 | russ
yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!! please check your incoming material prior to processing please check your reflow profile to ensure that max temp
Electronics Forum | Thu Aug 31 18:19:27 EDT 2006 | dmascare
I am currently contemplating the purchase of a pcb prototyping machine. The machine will be used to prototype some patch antennas, microwave circuits, embedded systems, boards for various surface mount chips evaluations, possibly milling PZT materia
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