Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Mon Oct 09 09:56:11 EDT 2000 | John
I've run up against the same problem that I know many of us in the industry face; our management wants to obtain a "world class" level of production. This has come up before, and I've looked through several responses dealing with ppm (dpmo), failure
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Thu Aug 24 12:04:05 EDT 2000 | Wolfgang Busko
I see that it�s not a well intended process you run, just born out of necessity. It�s good to see that someone always finds a solution (McGyver-like) if he encounters a problem although this one seems rather specific. Normally I would say "never chan
Electronics Forum | Wed Aug 16 22:32:15 EDT 2000 | Dave F
John: It's easy to put parts in the wrong place!!! Isn't it? Starting at the beginning: check the part at incoming inspection ... measure the value upon receiving the part, if it's possible. Verify the marking on the part. Next: Prevent things f
Electronics Forum | Thu Aug 03 19:49:16 EDT 2000 | Darby
I presume you have no vision alignment. Buy yourself a little monocular measuring microscope ( about $100 ). You are not going to get the registration you require between stencil and pcb for each print if you are running off tooling pins , edge clamp
Electronics Forum | Fri Jul 14 16:35:03 EDT 2000 | Dave F
Celia: Ubet. Sorry about the ranting. (It comes with the territory.) I don�t recall any peer reviewed stuff, but I seem to remember a couple of articles on white tin in "SMT" "Circuits Assembly" Magazine (er suppin� like that), but it was probabl
Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F
Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.
