Electronics Forum | Thu Aug 02 21:22:15 EDT 2018 | davef
I need your input. What are your thoughts? Currently SMTnet is looking to improve process. It uses four different lists of categories that all are maintained and updated separately. A single LIST makes sense. Approaches to arranging the LIST being
Electronics Forum | Thu Feb 14 11:04:41 EST 2019 | SMTA-Bob
Bob Willis Book Reviews for Electronic Assembly https://youtu.be/IkQFFT4DT5U Three new books this month, hopefully there is something that will have you visiting the book shop or online service soon like http://www.smta.org Nanopackaging Nanotech
Electronics Forum | Tue Apr 09 17:33:45 EDT 2019 | tey422
I just assigned to make an IQ/PQ/OQ validation report to prepare for a couple of new yet very simple medical assemblies we are to build for. I have no idea how to make this report. All I know is I have to come with the validation report for all the
Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous
ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l
Electronics Forum | Thu Jan 05 14:04:44 EST 2023 | unisoft
>> The Unisoft ProntoPLACE software ( https://www.unisoft-cim.com/pcbplace.php ) creates programs from CAD or Gerber or XY rotation and BOM files for setup of SMT Pick & Place, thru-hole, manusert & dispensing machines, and includes the basic feature
Electronics Forum | Fri Oct 23 18:13:53 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Electronics Forum | Thu Oct 14 12:12:21 EDT 2004 | Shean Dalton
Hello JB, Based on the double sided assemblies, the misprint cleaning process can demand the cleaning system to remove both raw solder paste from the misprinted side of the board, and, reflowed flux residues from the assembled side. Recognizing and
Electronics Forum | Tue Jan 10 16:01:20 EST 2017 | davef
A review document for J-STD-001F with Amendment 1 had the following wording, but you should check the actual document to be sure of correctness 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at le
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Tue Nov 28 13:26:59 EST 2000 | Graham Naisbitt
Terry Sorry, I just re-read your question and failed to answer all your questions: Shadowing only applies to coatings that are UV curable. Neither of these are UV curable. You do not want this technology for 3 dimensional assemblies, it is too expe
