Electronics Forum | Tue Jul 06 07:49:08 EDT 2004 | davef
Q1)What is the MSD level for PCB? A1) There is none Q2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assem
Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Sat Sep 25 03:44:38 EDT 2004 | GS
Thanks Davef, unfotunately in order to keep TIC of PBA inside our customer TIC requirements, we have to pre-wash (DI water only)connectors before assembly. Too high level of Br- continuosly get released by connectors molding compound. Our assemb
Electronics Forum | Mon Oct 04 11:47:00 EDT 2004 | HOSS
We are trying to deploy an Ionograph cleanliness tester and wanted to know what others are using as a standard test sample. My desire is to run the test on a weekly basis using the same medium complexity assembly. We plan to use the testing as a pr
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Mon Dec 13 16:25:37 EST 2004 | saragorcos
Hi Scott - No clean assemblies have a very low tolerance for processing residues, and long term reliability is compromised if residues from incoming bare boards, components, or un-solublized flux residues are not dealt with. It is critical to contro
Electronics Forum | Fri Feb 18 11:54:21 EST 2005 | carterhoward
Hi frank, At first we did see some issue with moving the boards. We placed the AOI�s in as central location as we could. Basic we do first articles and sample QC�s from the less critical locations like paste inception and TH. And then run 100% QC o
Electronics Forum | Tue Mar 01 10:31:26 EST 2005 | Greg
QC --> Touch-up --> QC --> Assembly After SMT all PWB goes to QC, QC Inspects and marks all that needs rework then PWB's goes to Touch-up to fix what QC marked for rework. After that All reworked boards goes to QC for another verification and stampi
Electronics Forum | Thu Jul 14 16:07:16 EDT 2005 | saragorcos
Here is a link to a specific article about cleaning no-clean assemblies: http://www.residues.com/pdfs/Clean_No_Clean.pdf Our facility does a lot of contract cleaning and cleanliness testing for various companies around the world, and that study s
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