Electronics Forum | Mon Nov 19 02:33:26 EST 2018 | davis
Hi Tushar, I used http://www.pcbnpi.com for over 2 years. They can provide PCB prototype, PCB assembly, and stencil service. Prices are affordable! Very professional and I can rely on them and they always come through. So I highly recommend to you!
Electronics Forum | Sat Apr 28 08:04:29 EDT 2018 | shuhaib
Hi, please go through IPC 7093, its only for design and assembly process implementation for bottom termination components. its says up to 50% voids will not reduce ant electrical and thermal performance.
Electronics Forum | Thu Nov 02 15:45:04 EDT 2017 | dleeper
For low volume hand assembly, deionized water or IPA should work fine.
Electronics Forum | Thu May 04 13:35:28 EDT 2017 | jmathis
Hello All, I was given an assembled flex circuit PCB and asked how the board was depanelized as there are no view-able witness marks that I can see. Any ideas? Thanks in advance on any insight to depanelizing without leaving witness marks on the F
Electronics Forum | Wed May 31 07:16:06 EDT 2017 | stephendo
Don't rule out the possibility that the board shop depanelized it and it was assembled after depanelization. Been there, dealt with it, expletives deleted.
Electronics Forum | Thu Jul 20 03:42:58 EDT 2017 | sophyluo1985
Hi Sir, One of my customer whom localed in Hongkong. If you still want to know them, i will send you the contact number. Sophy
Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto
I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.
Electronics Forum | Wed Jun 28 07:31:48 EDT 2017 | jamesbarnhart
The IPC A-610 is the most widely utilized inspection standard for electronic assemblies is now updated. It is now moved at Revision F and there are things many new things we need to know about this. Plz explain in detail the major updation in this mo
Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef
If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components
Electronics Forum | Mon Jul 10 02:33:48 EDT 2017 | dawson
"The Pin-in-Paste process can be used to solder through hole components using surface mount assembly process steps." I find it at https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5 Hope is helpful
