Electronics Forum: assemble (Page 226 of 598)

PCB Solder Finish Survey

Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis

PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t

BGA REBALLING

Electronics Forum | Fri Jul 23 01:03:28 EDT 1999 | KYUNG SAM PARK

HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 manufactured by 0.k international ] ��DESOLDERING HEAT ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING

Re: product changeovers

Electronics Forum | Fri Jul 02 00:33:57 EDT 1999 | Scott

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F

| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

BGA Heat Sinks

Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten

Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly

Re: What???

Electronics Forum | Thu Jun 17 09:27:50 EDT 1999 | John Thorup

| | Anyone at Nepcon East or in the Boston area who could answer a few question about assembly equitment and SMT manufacturing, on the afternoon of 6/17 - please e-mail me before noon. | | $100 for your answers. | | | Sounds like it's ... Sam, ou

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 04:38:05 EDT 1999 | Gyver

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Component Thermal Profiles

Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton

Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo


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