Electronics Forum: assemble (Page 436 of 598)

Print-Glue-Wave process

Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi

That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,

BGA attach eval.

Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr

Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

BGA Rework

Electronics Forum | Thu Apr 10 10:12:33 EDT 2003 | Claude_Couture

Chrissie, You have my deepest sympathies! But I'm very curious about your business takling a space contract. The quantity of boards that you mentioned hints at a GPS satellite systems, am I correct? In any space quality manufacturing, every step of

Parylene Coated BGA Rework

Electronics Forum | Sat Apr 12 09:47:07 EDT 2003 | davef

... continuing with Q2: How do you remove and replace? A2: Belt sander, sand blasting, grinding wheel, etc. Parylene/Paraxylyene is a great coating and can be selectively removed by several methods. The IPC-7711 (Rework of Electronic Assemblies)

SMT solder pad design for hand soldering

Electronics Forum | Sat Apr 19 12:00:07 EDT 2003 | modeltech

I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly. My proble

enviroment for best working

Electronics Forum | Wed Apr 23 13:33:31 EDT 2003 | davef

We divide our operations, repair, and office facilities into work area classifications, each with its own set of requirements and necessary control to meet the requirements of our procedure. The requirements are in the areas of: * Air Quality * Ligh

Flux residue?

Electronics Forum | Wed Apr 30 14:35:35 EDT 2003 | clarkk

Hello all, We have received reports from two customers about electrical leakage on pcb assemblies that used Kester paste #HM531 (63/37) and washed with Kester 'Bio-kleen' saponifier and DI water. The leakage is such that when the boards receive power

15.7 mil QFP

Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ

We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you

Thermal resistance of a given copper area

Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef

No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p


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