Electronics Forum | Fri Jan 12 12:35:58 EST 2007 | realchunks
Several things to check. Are you reflowing towards higher temps for the no-lead parts? If so are you using a 63/37 paste? If so you are buring your flux off too early. Get a solder paste designed for lead free parts on a leaded baord. There are
Electronics Forum | Fri Dec 15 09:44:38 EST 2006 | mashmo
Hello I am a circuit board designer and just wanted to ask if anyone is seeing the need to alter footprints for ROHS assembly. I also wanted to make sure that I have this particular issue correct. If your BGA is lead free then used solder paste with
Electronics Forum | Mon Dec 18 14:22:59 EST 2006 | samir
Hi Real Chunks! Hope to see you in LA February. You planning to attend that Bismuth seminar? :-) Anywho...so true. Some Design Engrs. who've never done any real work in their lives think that we can make printed circuit board assemblies using co
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Fri Dec 22 14:38:34 EST 2006 | Mike Z
We are undertaking a project to try to put a rating system to our DFM documents for both PCB design, final assembly, and testing areas. I am wondering if anyone has found a tool that has been used as a DFM rating system so that I may save some time
Electronics Forum | Thu Dec 28 22:58:30 EST 2006 | davef
If this is same TennRich Type B [ http://www.tennrich.com/trtw/TR_PI_Prod_Info.php?pid=2 ] that is an EMI gasket, it needs to be glued with a conductive adhesive. It has the same thermal capability as a Snickers Bar, about 90*C top end.
Electronics Forum | Tue Jan 02 17:39:45 EST 2007 | fastek
Personally I wouldn't care what the industry standard is....if I was producing something where 15 out of 100 failed, it would not be acceptable. Determine why this is happening and fix the problem and don't be concerned with what anyone/everyone el
Electronics Forum | Thu Jan 18 09:54:22 EST 2007 | SWAG
Thanks for your advice, all. We do not use tooling, Pavel. We requested a board thickness change from our customer - it turns out that the unusual thickness was designed for mechanical fit-up only and this thickness is no longer a concern as the as
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Tue Jan 09 22:33:45 EST 2007 | Guest
Dear AJ, Try removing shield ,test it, verify if it would perform as the previous runs . If not, there maybe something wrong with device or as one of our collegue mentioned that there is possibilty the your customer change some components.If the
