Electronics Forum | Wed May 24 15:28:09 EDT 2000 | John Thorup
Hello Travis I'm going to have to disagree with your evaluation of intrusive reflow. It's not just for low end and,if done correctly, you will not have lots of half soldered leads and touch up will be minimal if at all. I'm sure that others will ag
Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Thu May 18 20:47:14 EDT 2000 | Dave F
Ed: It might be possible, never tried tho, but if an engineer wandered in, talking about it ... Printing: Makes me pretty nervous, because punched boards are not planar, don�t stay planar, and are inconsistently not planar. If I could work-out th
Electronics Forum | Thu May 18 08:32:02 EDT 2000 | Nancy V
Janet, I like Dave's advice. I would send you first to www.smtmag.com They have articles there that give the basics of SMT. Look for the button that says "Step-By-Step SMT." It will give you a touch of what your in for. Then find a good book. I
Electronics Forum | Fri May 12 04:46:32 EDT 2000 | Wolfgang Busko
There�s obviously still a lot of work to be done to get those "beasts" on the board. I wonder if anybody has solved the problems already and is able to say "we do it and it�s working well under the following conditions". I read the article in the las
Electronics Forum | Mon May 08 20:52:18 EDT 2000 | Dave F
Steve: A couple years ago, I decided that I needed to broaden my education in the areas(s) that I make my livelihood � soldering and assembly. I had attended some excellent (and some not so excellent) tutorials at NECON, but just felt I was missing
Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
Electronics Forum | Tue Apr 11 20:23:19 EDT 2000 | Dave F
Ashok: You're still goin' down that ol' ESD road aren't ya bud? Why do you need the boards to be dry? Conformal coating? Hey wait a minute, are you one of those no-clean people? Er zis related to the Kapton tape res fandango? Anywho, be careful
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
