Electronics Forum | Thu Aug 01 10:09:31 EDT 2002 | sueph
Dave, I would have never thought of the sheet metal box. My west coast contact, who has dealt with this type of board before, told me yesterday to go ahead and try it at this profile anyway, as the metal plating holds more heat. I was pleasantly
Electronics Forum | Tue Jul 30 13:58:26 EDT 2002 | dragonslayr
To all SMTneters: I am seeking recommendations for software packages. I will be managing a Document Control Center for a Contract Manufacturer. I am aware of the functions, duties but do not know the commercial names of software needed. We will be ne
Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike
I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a
Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM
Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at
Electronics Forum | Tue Aug 13 13:50:57 EDT 2002 | ksfacinelli
A couple of years back we saw the same issue. It was when we were using a water soluble flux on a post wash assemble for a power switch. This was corrected when we switched to a no clean flux product. The appearance of the no clean products is les
Electronics Forum | Thu Aug 15 09:02:04 EDT 2002 | davef
The fine SMTnet Archives have a couple of threads on double side reflow. Bob Willis Technical, Director, SMART Group, produced a Charity Report on the specific process of Double Sided Reflow Assembly. You can get the report from the SMTA [ http://w
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail
Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou
Electronics Forum | Mon Sep 02 11:52:51 EDT 2002 | davef
We looked at RFID labels for finished assembly tacking. Most of the applications of RFID are used to prevent inventory shrinkage of expensive clothing. Although, increasingly companies are using RFID in security applications. The ISO 15693 standar
