Electronics Forum | Tue Mar 13 17:29:18 EDT 2007 | Oswaldo Rey
I placed a Maxim MAX16810 38 pin TQFN with a power pad ground on the bottom of the chip on a prototype board FR4 doble sided. Vias of 0.6 mm where placed underneath part, 6 vias in total. Solder was placed with an air operated syringe, land pattern w
Electronics Forum | Wed Apr 04 14:29:16 EDT 2007 | rgduval
Anyone have experience wave soldering rigid flex assemblies? I've just picked up a new job from a customer; it's a rebuild for the company, but new to me. The customer had previously taken their business elsewhere due to delamination problems with
Electronics Forum | Tue May 01 01:39:16 EDT 2007 | basem
Acquire a fast dispensing machine that can deposit solder paste to keep a low volume pick and place machine working. This would save us two things: 1) Stencil delivery waiting period for customers who bring with them their PCBs fabricated in the loca
Electronics Forum | Thu May 10 21:45:41 EDT 2007 | davef
Comments are: * Mass lead trimming equipment suppliers are: ** Q Corp; 301 River St, Derby, KS 67037; 800-835-1099 316-788-3746 F316-788-7428 qcorporation.com qcorp@qcorporation.com ** Microscan [LT1821 Lead Trimmer]; ?? ** Roto-Form; PO Box 118; Si
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse
Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
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