Electronics Forum: assemblers (Page 431 of 598)

First piece inspection

Electronics Forum | Fri Jan 11 04:20:52 EST 2002 | wbu

It�s up to you what and how you perform. I was only wondering how your figures match with todays performance efforts and predictions made by the industry. The stress today is obviously on change over times and concepts to minimize this time especiall

Rework using flux pens

Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia

We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes

Adhesives

Electronics Forum | Wed Jan 09 11:09:53 EST 2002 | slthomas

Is anyone still using Loctite 348 chipbonder for bottom side attachment? Is it truly adequate for dispensing up to 18k/hour? We will be dispensing with a Camelot 2800, so somewhere in the neighborhood of 15k/hr. is as fast as we'll ever see. I'm c

BGA solder joint integrity

Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain

Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly

Solder ball specifications?

Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef

On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar

Leakage resistance in PCB

Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef

1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff

Wave solder question

Electronics Forum | Tue Feb 19 14:00:55 EST 2002 | global

We have had some discussions about what causes parts to lift out of the holes when going over the wave on our flow solder machine. The machine being used is a Treiber (700 series). There are two bottom pre-heaters and one top pre-heater. We try to pr

Cpk Variables Control for Paste Printing

Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef

Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Tue Mar 19 11:56:03 EST 2002 | davef

Hany: How could you let this happen? ;-) The real issue is how best to remove the VSOP. You can argue if there is one clearly superior method. Consider trying several methods and let your operators select the one that makes sense to them. Replac

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Tue Mar 19 15:38:48 EST 2002 | stefwitt

For a few thousend boards, I would look into some automation. In order to get the components off the boards you could run the boards through the reflow oven with the cooling fans turned off. When the boards come out of the oven the solder is still l


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