Electronics Forum | Mon Mar 24 20:30:01 EDT 2014 | davef
The "correct" answer is: Use the tests and methods that you used to qualify your solder paste in the first place. That sounds good but might not be all that practical for practicing assembly-types. Here's something that's not as good, but will give
Electronics Forum | Tue May 20 18:38:23 EDT 2014 | hegemon
From the picture I would say the problem lies with the PWB manufacturer. It looks as though some part of the plating process was not optimal during the PWB production run, and you have the resulting discoloration following the reflow process. What
Electronics Forum | Sun Jun 01 13:50:12 EDT 2014 | sync40
Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we res
Electronics Forum | Mon Jun 02 15:51:17 EDT 2014 | sync40
Thank you so much again davef for your new reply. This past weekend I was looking for more information regarding this subject, but, as you stated there is no information about thioruea concerns during assembly soldering operations, mainly focused in
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
Electronics Forum | Fri Jul 18 03:21:59 EDT 2014 | skipbruce
Hello June The following infomationI find from net for you reference. OSP (Organic Solderability Preservative) 1)Preserves copper surface from oxidation until asse mbly. 2) Very thin coating (100-4000 Angstroms). 3)Applied in a vertical (dip tank
Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech
Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Thu Sep 25 07:45:41 EDT 2014 | emcglobaltechnologies
Good morning, I hope you are doing well today, please allow me to introduce myself. My name is John Wasserman and I am the Sales Manager for EMC Global Technologies. We manufacture fixtures and tooling for the processing of printed circuit board ass
Electronics Forum | Wed Aug 27 12:38:48 EDT 2014 | fuji_user_2014
We do a lot of low volume prototypes and several boards that have have cut outs or fixtures that dont always reliably stop squarely at the in carrier (beveled corners). This sometimes results in a fid read error, because the fid wont be in the search
