Electronics Forum: assemblers (Page 61 of 598)

Attending the IPC/SMTA Electronics Assembly Expo?

Electronics Forum | Fri Sep 18 11:54:43 EDT 1998 | Cunli Jia @ SMTnet

To All, SMTnet is considering exhibiting at the IPC/SMTA Electronics Assembly Expo, Oct. 27-29 in Providence, RI. We may also host a free conference session, discussing how to best use the Internet for speeding up product design, production, and del

Clean raw bds

Electronics Forum | Fri Aug 14 08:30:44 EDT 1998 | Pat Copeland

Where can I find a spec to put on my fab drawing, to call out the cleanliness of the board, before I recieve it. These boards will require a tight spec after they are assembled, so I want to know that they are clean when I get them. Any suggestions.

To Sided PCB

Electronics Forum | Sat May 30 11:25:51 EDT 1998 | S�rgio Luiz Vito

We are a company assembler of telephones and PABX equipaments from Brazil. At the moment, We ares preparing our process for the assembly of PCB with component SMD on both sides. We will appreciate a lot if somebody can contribute with suggestions or

Looking for Existing ASSEMBLY BUSINESS FOR SALE

Electronics Forum | Sun Mar 29 16:56:53 EST 1998 | Sam Sangani

I'm looking for existing assembly business for sale in Tri-State(NY,NJ,CT)area. We are the largest PC boards and SMT laser CUT stencil manufacturer in the state of NJ. Please contact me directly at 973-284-1600 or E-mail me at pnc@nac.net. Thanks in

Re: Quality calculation for SMT

Electronics Forum | Tue Mar 24 09:53:01 EST 1998 | Steve Schrader

| What is the right way to count the opportunities for defects in order to calculate the quality (in ppm) of SMT assembly processes as well as the quality of the PCB's? | Please replay to: | fogel_m@netvision.net.il | or | micha.fogel@ecitele.com Ch

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:32:25 EST 1998 | Earl Moon

| We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon

| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest

Packing material, the right track ?

Electronics Forum | Thu Aug 23 11:55:21 EDT 2001 | wbu

TA, is there somebody out there who can bring on the right track according adequate materials for long term storage of assembled boards (at least 10 years)? It�s for spare parts for future service exchange. The units should be stored seperately and

lousy wetting of 0805 film caps

Electronics Forum | Thu Aug 23 16:01:59 EDT 2001 | Steve

You made the statement "The rest of the board we use them on looks great..." My question is, what's the difference between the assemblies? Mass? Solder? Oven? Are the boards the same thickness, are other parts causing heat sinking, etc. The reflow m

External Factors to be controlled during assembly

Electronics Forum | Sat Sep 29 08:19:16 EDT 2001 | davef

The current version of ANSI/J-STD-001, "Requiremnts For Soldered Electrical & Electronis Assemblies" is C [3/00]. The following sources can help you: * IPC http://www.ipc.org * SMTA http://www.smta.org * Document Center http://www.document-center.c


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