Electronics Forum: assembling (Page 236 of 598)

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Wed Mar 20 06:20:18 EST 2002 | hany_khoga

Thanks Dave for this contribution. After a lot of discussions with colleagues I found a general tendency to use the air hand tool. Could you please send us detailed steps of using those air guns, considering the distance between the gun & the PCB, t

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Wed Mar 20 17:18:08 EST 2002 | alex_kirichenko

Hello everyone!! About hot air tool.... Most of the the brands will supply you with specific nozzel for the package to be removed, it will heat up leads only, so you don't have to mask anything (sounds like less work :) ) by the way I had to take

Adjustable Reflow Pallets

Electronics Forum | Fri Apr 26 11:11:53 EDT 2002 | Mike Frye

I am looking for anyone who may have information on adjustable reflow pallets. Could you please provide a supplier and contact. My dilema is that during an initial NPI build the PCB's may not arrive with rail adds. I need a way to transfer this PCB t

Industry Question

Electronics Forum | Thu May 02 17:35:15 EDT 2002 | davef

Dunno. Visioning markets beyond our factory walls may be a bit far afield for some of us. Consider contacting a market research firm. For instance Keith Robinson [Frost & Sullivan krobinson@frost.com 210-247-2402] wrote an article on the electron

double side reflow soldering

Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch

Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to

stencil design software

Electronics Forum | Fri May 17 11:10:25 EDT 2002 | wister

Is there any software to design the stencil openings? It may be including automatic modify the aperture,monitoring aspect ratio and area ratio,even let you know the whole vloume of the opening and average ratio?because the stencil design is more impo

assembly serialization and traceability

Electronics Forum | Fri May 31 16:26:22 EDT 2002 | Feederman

Steve, you might want to check out the pre-printed and print-on-demand label feeders that are available through Hover-Davis. These types of feeder remove the potential human placement errors which sometimes occur. The feeders are available for most p

BGA Assembly

Electronics Forum | Mon Jun 03 22:16:49 EDT 2002 | alex_kirichenko

Hi Jim! Just an idea.... There are some reflow ovens which use cooling on the bottom side of pcb during reflow for doublesided boards. It prevents solder on the bottom side to melt. You might try cooling your BGA while reflowing parts on opposit s

Solder Balls in Vias

Electronics Forum | Tue Jun 04 11:14:48 EDT 2002 | ckd

Hi All - My question is how do solder balls form and stay in the vias? The assembly goes thru SMT top placement, reflow then thru hole components mounts on top side as well. The board is sent thru the wave solder process. Has anyone experienced this

Maximum Number Crimps in Terminal

Electronics Forum | Wed Jun 05 14:24:57 EDT 2002 | davef

IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies It took the fine folk at IPC forever and a week to produce A-620. So, we continue to use NASA-STD-8739.4, Crimping, Interconnecting Cables, Harnesses, And Wiring that


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