Electronics Forum | Tue Nov 28 15:06:59 EST 2000 | rabell
We have recently moved our "ESD: See it! Believe It! Control It!" product to a network version. This particular course is aimed at engineers and technicians, and these people typically already have a computer on their desktop, so providing the train
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Wed Jun 06 20:25:06 EDT 2001 | davef
Good machine, good people; yer just about there. Look here for help: http://www.mot.com/SPS/PowerPC/teksupport/teklibrary/papers/BGA_AssemblyRework.pdf http://channel.intel.com/design/quality/component/rework_socketprofiles.htm Earl Moon, a depart
Electronics Forum | Wed Jun 13 17:50:06 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Wed Jun 13 17:50:28 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Fri Jun 22 10:54:40 EDT 2001 | davep
The part is a high pin count PBGA with an integrated ceramic heatsink. What I am trying to understand is how to handle this part in production. It seems as though you would have to have an oven very near your SMT line, pulling a few trays of parts
Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
Electronics Forum | Wed Jul 25 10:46:36 EDT 2001 | Steve
Most of the problems that you will find with NC is visual. I have not found or heard of any real evidence that NC causes component or board failures. The residue has extremely high resistance, which actually gets higher as time goes on. It's a paradi