Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Wed Aug 18 21:18:00 EDT 1999 | Dave F
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Aug 19 10:36:53 EDT 1999 | John O'Brien
| CAN ANYBODY ADVISE ME AS TO INDIVIDUAL PCB IDENTIFICATION THROUGH ASSEMBLY - THE PROS AND CONS | | THANKS | Leo: I have been doing a bit of research on this topic recently. I would be glad to discuss it with you. It seems the best technology is
Electronics Forum | Mon Aug 09 15:51:42 EDT 1999 | John Thorup
| Greetings, | | Would like to buy a 3 phase UPS for our Mydata TP11. | Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? | Called Mydata and suggested 2.2KVA per phase. | I wo
Electronics Forum | Wed Aug 04 14:34:50 EDT 1999 | Dave F
| Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental condit
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Tue Jul 20 06:36:50 EDT 1999 | Peter Brant
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hi, The usual method is ATE, also known as a "Bed of nails" Basicall
Electronics Forum | Thu Jul 15 18:58:48 EDT 1999 | Earl Moon
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Thu Jul 15 10:28:49 EDT 1999 | Boca
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti
