Electronics Forum: assembling (Page 86 of 598)

Re: Double sided BGA assembly

Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean

If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det

Re: thanks

Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F

Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-

Re: quoting smt assembly

Electronics Forum | Thu Dec 23 15:29:48 EST 1999 | Glen Robertson

Mike - I'm not in the EMS business, but I suspect most of them are very reluctant to reveal much about their quoting process. You might want to try some of the third-party data suppliers like Ceeris (www.ceeris.com), and you can also check the C

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.

Re: Wave soldering temperature

Electronics Forum | Thu Nov 04 14:13:34 EST 1999 | John Thorup

Hi Tim It sort of depends on the solder alloy being used and the particular assemblies being soldered. If you are using the usual 63/37 alloy I would consider 500 to be a bit warm unless the assembly required it. Some alloys would require a higher

Re: mixed technology

Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner

If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r

Re: Popcorning BGA in wave-soldering

Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech

We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the

Re: Use of chip bonding adhesive.

Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper

Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th

Cost per placement measure

Electronics Forum | Mon Oct 04 10:26:59 EDT 1999 | Morris

I am working on trying to define a cost per placement measure in our SMT assembly operations. Does anyone know where I might find a published industry average that we may compare to? I�ve heard it stated that an industry average is less than $0.01

Re: What???

Electronics Forum | Fri Jun 18 15:35:53 EDT 1999 | M Cox

| | | Anyone at Nepcon East or in the Boston area who could answer a few question about assembly equitment and SMT manufacturing, on the afternoon of 6/17 - please e-mail me before noon. | | | $100 for your answers. | | | | | Sounds like it's ...


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