Electronics Forum | Thu Jun 04 11:10:23 EDT 2009 | leemeyer
Are you refering to components or assemblies. Assemblies are classified as 1,2 or 3 per IPC-A-610. Components are classified 1 - 6 for moisture sensitivity per J-STD-020
Electronics Forum | Tue Nov 18 20:03:19 EST 2008 | davef
Here are people at IPC that can direct you to the people you need to talk to about the issues that you have with the standards: * Jack Crawford, IOM, IPC Director Certification and Assembly Technology, crawja@ipc.org 847-597-2893, 847-615-5693 * Dav
Electronics Forum | Thu Jun 04 17:32:20 EDT 2009 | bigdaddysoy9
If you are talking about assemblies, Class 1 is like cheap toys or something you wouldn't expect to last very long. Class 2 would be components for a television, air conditioner, automobile (except safety critical). Basically, things that you would b
Electronics Forum | Tue Nov 18 19:24:07 EST 2008 | act_smt
I'm just wanting something solid to show my workplace. I am under the belief that it is a flattened coined lead. But like how i've been trained in IPC, I have to be able to prove that it is true... or that IPC says it is false. We have a customer tha
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Fri May 31 16:26:22 EDT 2002 | Feederman
Steve, you might want to check out the pre-printed and print-on-demand label feeders that are available through Hover-Davis. These types of feeder remove the potential human placement errors which sometimes occur. The feeders are available for most p
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas
What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,
Electronics Forum | Fri Dec 27 16:26:30 EST 2013 | davef
I expect to find the specification and measurement method for the bow & twist of an assembly to be on the assembly drawing. Comments are: * Expecting that an industry committee to write a bow & twist spec for an assembly they know nothing about is n
