Electronics Forum: asymtek and a-618c (Page 1 of 1)

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

When to Underfil CSP and uBGA ?

Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef

There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID


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