Electronics Forum: attach (Page 1 of 155)

Can't attach picture

Electronics Forum | Fri Mar 04 00:57:15 EST 2011 | kemasta

I have this error when try to attach picture, please help:- Attribute validation error for tag CFFILE. The value of the attribute destination, which is currently /var/www/smtnet/Forums/Attachments//, is invalid. The error occurred on line 12.

Beam lead attach

Electronics Forum | Tue Oct 19 14:51:27 EDT 1999 | Kiet Dang

I'm trying to set up a SPC for a thermo compression beam lead attach process. We're using a west bonder thermo compression machine. I'd appreciate any input on temperature, pressure,tool, and critical process considerations. thanks, -kiet.

ball attach on flex

Electronics Forum | Mon Oct 15 11:27:48 EDT 2001 | rob_thomas

Hello all, Does anyone have any experience using solder quick preforms for ball attach on Flex? Thanks, Rob

Can't attach picture

Electronics Forum | Tue Mar 22 14:03:35 EDT 2011 | mlerley

Sorry about that -- it's fixed now.

BGA attach eval.

Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr

Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while

BGA attach eval.

Electronics Forum | Tue Apr 01 19:36:02 EST 2003 | iman

from my humble experience : 1) check if there is nickle contaminate in the gold bath? shd have report data from the PCB fab house. 2) check if your production did 48hr bake at 125degC, IF the BGA did not come in its "original" MSD cozy packaging.

BGA attach eval.

Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr

Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li

BGA attach eval.

Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef

RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th

BGA attach eval.

Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf

I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro

BGA attach eval.

Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef

You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai

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