Electronics Forum | Wed Sep 23 17:35:27 EDT 1998 | Chrys
| All y'all, | We use two methods to secure/stake jumper wires to boards: | 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. | 2 Loctite 382 Tak Pak | We use Tak Pak "99&44/100ths" more often than
Electronics Forum | Thu Sep 24 07:37:32 EDT 1998 | Earl Moon
| | All y'all, | | We use two methods to secure/stake jumper wires to boards: | | 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. | | 2 Loctite 382 Tak Pak | | We use Tak Pak "99&44/100ths" more
Electronics Forum | Mon Sep 21 12:04:39 EDT 1998 | Chrys
| Say, you company wants you to set-up a new assembly line. You get: | 1 $2 million for any equipment that you want to purchase and no idiot bosses second guessing your choices | 2 New building with good parking and enviromental and ESD controls | 3
Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach
I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Tue Jul 21 21:09:49 EDT 1998 | Steve Gregory
>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b
Electronics Forum | Wed Jul 22 13:59:52 EDT 1998 | Justin Medernach
>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b
Electronics Forum | Wed Jun 24 17:07:40 EDT 1998 | Earl Moon
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
