Electronics Forum | Thu Apr 29 18:48:11 EDT 1999 | Kiet Dang
Hi, Did anyone experience a problem with electrically conductive silver filled epoxy is resistive due to galvanic reaction? I'm having this problem when attaching components to Ni plated housing while conducting an experiment to cost reduction for Au
Electronics Forum | Tue Apr 27 06:35:33 EDT 1999 | Dan
Using moss fets attached to sub heatsink and hard coat anodizing sub heatsink at higher cost and erratic performance. Looking for thermal tape, insulator to replace hard coat that will prevent shorting.
Electronics Forum | Sun Feb 28 11:51:18 EST 1999 | Wayne Bracy
| I am trying to get assess into the SMEMA, but for past 2 weeks it seems like servers was down, can anyone from SMEMA let me know is there any change in website. | Thank you | You can try the attached URL. It will take you to the IPC SMEMA Council
Electronics Forum | Mon Jan 11 20:59:20 EST 1999 | Reginald
I've heard about these reflow temperature labels/stickers but haven't seem to find them. Is there such a thing? And how reliable are they? I don't want to keep attaching thermocouple probes onto a board whenever there's a issue.
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Tue Jan 05 13:46:08 EST 1999 | Chrys
I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, Chrys
Electronics Forum | Mon Feb 23 23:24:13 EST 1998 | Craig Fernandes
Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process.
Electronics Forum | Thu Feb 12 17:25:15 EST 1998 | Chuck Griffith
What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
Electronics Forum | Fri Feb 27 14:27:54 EST 1998 | David Spilker
| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
Electronics Forum | Fri Feb 13 12:56:23 EST 1998 | Scott Cook
| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch