Electronics Forum | Mon Sep 23 08:42:25 EDT 2002 | bdoyle
I have performed many insourcing vs. outsourcing analyses. The following are the key issues that are normally evaluated: Cycle time requirements for product development and manufacturing Cost of manufacturing (in-house vs. subcontracted) Inve
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Fri Sep 20 17:41:09 EDT 2002 | davef
Neither. It would be better if the person posting thread said, "I searched the fine SMTnet Archives, but couldn't find an answer to my question. Now, here's what I'd like to know ... " Barring that, it would be better to start a new thread, becaus
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Fri Jan 10 08:52:31 EST 2003 | nifhail
We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology. In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and pro
Electronics Forum | Thu Feb 06 14:27:18 EST 2003 | MA/NY DDave
Hi You already have some good answers. Let me add just a little of what I know. You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology. Checking with e
Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef
First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef
RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th