Electronics Forum | Tue Jun 13 04:46:15 EDT 2006 | AR
Has anybody else noticed a problem with Assembl�on's mechanical 12 mm feeders, with 4 mm pitch? We are experiencing grave pickup problems with a MELF diode packed this way and fed with this type of feeder. If I attach a hefty weight to the blister ta
Electronics Forum | Mon Jun 26 10:58:16 EDT 2006 | J.E.M.
Question for anyone using panasonic super thin surface mount light touch switches EVQ-PLDA15. The above part has a recommended land pattern with two gnd pads.There is a little tab on each side of the part that i assume is suspose to make contact wit
Electronics Forum | Mon Jul 31 19:52:51 EDT 2006 | darby
TOOLING > OFFSET. The pcb stopper is attached to the camera and a default stop position is calculated from the PCB dimensions. If your stencil image is offset left or right then you can either fiddle the pcb size or input the offset. Offsets front an
Electronics Forum | Tue Sep 12 07:15:33 EDT 2006 | bwet
I have a thought question for you SMT process engineers out there. We are attempting to have a part selectively drop off in a reflow oven on a 2-sided l-f SMT assembly. In order for this to happen we will have to make sure during the reflow cycle th
Electronics Forum | Sat Oct 28 02:25:19 EDT 2006 | mika
Agree!! Where is Your thermocouple-probes attacded and can we get the info from this? Delta-T of the comp. is very, very important! The single most important smt-process step is the profiling/recipy and as a result of this, this poor package will cor
Electronics Forum | Fri Nov 03 12:06:07 EST 2006 | mika
Interesting. We are also facing this problem due to; once in a while a matrix tray is mishandled by the operators and as a result those very, very expensive components falls to the floor and the columns got bent. We manage somethime to "straighten th
Electronics Forum | Tue Nov 07 22:41:48 EST 2006 | davef
You are correct that hand soldering ceramic capacitors often causes them to crack. They do not take thermal shock well. You might be able to reduce the amount of cracking by following the rework repair guidelines discussed in the fine SMTnet Archiv
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
