Electronics Forum | Sat Mar 06 17:45:29 EST 2010 | isd_jwendell
Unfortunately, what you are calling a good fillet is not a good fillet. Solder on the top of the IC lead does not help to make a good connection. The most important fillet is the one located at the heel (think of the IC lead where it meets the PCB as
Electronics Forum | Wed Mar 10 18:42:34 EST 2010 | 89jeong
Hello Sir. We also encountered the same pin-hole issue but there was around MLCC.I also looked for some information in technical report and internet, But i failed to get an answer. As you know this pin hole or blow hole is caused by the solder boilin
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
Electronics Forum | Wed Mar 31 10:55:42 EDT 2010 | fredc
I worked on a nozzle for one of these LEDs in the past. I seem to remember that there are raised surfaces outside the pick up area. Be sure your nozzle is not hitting them, if so you will lose vacuum. A rectangle shaped nozzle would maximize your abi
Electronics Forum | Fri May 21 15:45:29 EDT 2010 | pforister
iv40, Thanks. The PCB that we are populating the BGA hybrid onto does not have holes in the vias. I think the manufacturer indicated that on their hybrid it has holes in pads. This hybrid is a PCB assembly with BGAs and other components populated
Electronics Forum | Fri May 28 01:47:05 EDT 2010 | jeffr
I have the part you need. The Yamaha Part number is K39-M7173-000. The same part is used on Philips machines using a different part number. This assembly is expensive because the motor is attached to a Harmonic Gearbox and encoder. I have a new unit
Electronics Forum | Thu Jul 01 15:12:16 EDT 2010 | siddharth
Thanks to all for their inputs. @Hexielectronics, I am now trying to assemble the board by attaching it to a frame and removing the frame while waving it. I plan to put the boards back on the frame after the board cools down. Could you explain more
Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray
I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
