Electronics Forum: b and on (Page 1 of 48)

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick

CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn

Dye and Pry on PoPs?

Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet

Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

Dye and Pry on PoPs?

Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs

In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce

Dye and Pry on PoPs?

Electronics Forum | Fri Aug 19 05:07:00 EDT 2011 | robertwillis

Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website I will also be doing a workshop at APEX and there is a webinar

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

I mounted the parts on the buck-boost DCDC converter and measured the characteristics

Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe

I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching

QFP on going on square (now and again)

Electronics Forum | Tue Apr 02 13:43:54 EDT 2013 | ericrr

On one of the products uses a QFP (Quad Flat Package)which is not going on straight, maybe 20 pins per 4 sides. sometimes I have to tweak the alignment before the board goes in the oven, this practice can be a bit of a worry if you over tweak it - pa

QFP on going on square (now and again)

Electronics Forum | Tue Apr 02 14:32:28 EDT 2013 | babe7362000

As far as I know you will have to get a whole new nozzle.

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