Electronics Forum: backing (Page 151 of 420)

Re: patches

Electronics Forum | Sun Nov 14 11:45:08 EST 1999 | Jeff Ferry

Back to Wolfgang's original request. Stacking chip components is just one of many unusual mods that are being added to IPC 7711 Rework of Electronic Assemblies. While some may deem this technique unacceptable, it is a relatively common practices

Re: No clean and f devices

Electronics Forum | Fri Nov 12 10:20:53 EST 1999 | Wolfgang Busko

Now an than I hear, read about the same thing but without mentioning specific frequencies. It�s something that worries me in the back of my mind but not in actual daily workflow. Our boards go up to 50Mhz with digital bus systems and are made with no

Re: Breaking scored boards, breaking components.

Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.

Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow

SMTnet Format

Electronics Forum | Fri Nov 05 19:48:41 EST 1999 | Todd

I really like SMTnet and the forum. However, I do not like the new format of the SMTnet because when you click on a response, you can not see the original question. Also, when you click on the latest response, you can not see all of the other respons

Re: PCBA First Article in production

Electronics Forum | Thu Oct 28 12:02:13 EDT 1999 | John Thorup

Automation and low cost is an oxymoron sort of like jumbo shrimp. Automation will set you back $20,000-100,000. Optical comparitors aren't cheap either. Low cost means good eyeballs, a "golden" sample board and up-to-date documentation. Also low c

Re: Bottom side adhesives

Electronics Forum | Wed Oct 27 11:32:57 EDT 1999 | Brian W.

When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on e

Re: message replys

Electronics Forum | Thu Oct 14 09:26:41 EDT 1999 | Clifford Peaslee

Brian & Nancy, Yes, our goal is to have the option of displaying the whole thread in one page while still leaving the current option available. Displaying all of the messages in a thread really doesn't work well with the old messages because they c

Varistor any experiance in correcting process contamination of.

Electronics Forum | Tue Oct 12 16:38:24 EDT 1999 | Charlie

At present the band-aid fix is using epoxy 'dam' under the part and masking over the part to pervent excessive current leakage conmonent failure. These parts are first going through the reflow oven, where the epoxy dam is used to over come the leakag

Solder Paste@ Board shop

Electronics Forum | Wed Oct 17 19:01:34 EDT 2001 | scott

We have a local shop here in S-Cal. called MaskTek that invented a solder deposition process that eliminates the need for solderpaste but you still need to use "sticky" flux. They license the process to various facilities around the country. Was pr

Re: No follow up, no participation

Electronics Forum | Wed Sep 29 18:40:24 EDT 1999 | Clifford Peaslee

Earl, Everything is quite hectic here. We are still trying to get our stuff together from Cunli's absence. It is difficult to replace him. Please don't take offense from my slow response time. We are aware of the problem of lack of communication and


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