Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager
When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Fri Feb 04 09:23:21 EST 2000 | Casimir Budzinski
If No-Clean flux does not need to be cleaned, then why do I get readings of up to 27(ug NaCl/sq in) on boards that are not washed, up to 23.4(ug NaCl/sq in) on boards washed with DI water only and from 1.2 to 10.1(ug NaCl/sq in) on boards washed with
Electronics Forum | Fri Feb 13 16:13:20 EST 2009 | jax
Many shops require levels for typical component packages on FR-4 or a like substrate to be 2, 9, 15, 1 and 10 mg/in2 for fluoride, chloride, bromide, nitrate, and sulfate respectively. These levels can change for Medical or Automotive.
