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New Equipment | Industrial Automation

Contact us if the item you are urgent.Often we have large stack to meet you needs ! Contact: Sandy Lin Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 M

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Electronics Forum: bake heatsink (1)

BGA Placement Process

Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala

Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu

Technical Library: bake heatsink (2)

Dealing with the Top Five Factory Floor Productivity Killers in the PCB Industry

Technical Library | 2009-04-16 22:38:55.0

The worldwide electronics industry has sales of $750 billion, two thirds of which is accounted for by PCB assembly. PCB manufacturing is characterised by an obsessive drive for increased productivity in the context of three significant industry drivers: shorter product lifecycles, more complexity, outsourcing

Mentor Graphics

Large Thin Organic PTFE Substrates for Multichip Applications

Technical Library | 2007-06-13 13:44:10.0

Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp.

i3 Electronics

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