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Using McDry Ultra Low humidity Storage Cabinets in High-Mix/Low-Volume Assembly | Seika Machinery, I

http://seikausa.com/news/using-mcdry-ultra-low-humidity-storage-cabinets-high-mixlow-volume-assembly

? This seems to happen just before performing an important job with sensitive parts when the bake-out time required will put you behind schedule °C to bake out tape-and-reeled parts without having to unreel and tray the components in order to withstand the 125°C bake. This process requires days instead of hours, so in some cases you may be forced to tray up parts if you need them in a hurry . Given that oxidation and intermetallic layer growth increase greatly as temperature increases, the preference is to avoid high-temperature bake out whenever it is practical . Finally, when it comes to heated drying cabinets, Trenton has found that a small unit is all that is needed because, if parts are being purchased correctly, this cabinet only will be used for bake-out sparingly . In addition, when using high-volume assembly, the assemblers know their jobs and have the assembly drawings memorized, and problems immediately stand out like red flags

See Seika Machinery, Inc's New Advanced Machinery at IPC/APEX 2011 | Seika Machinery, Inc

http://seikausa.com/news/see-seika-machinery-incs-new-advanced-machinery-ipcapex-2011

. The MB-301 Low Temperature & Low Humidity Baking Cabinet features a 40C° baking temperature, as well as a 5 percent RH humidity level during bake out period and 3 percent RH level in dry storage

Pressure curing vs Vacuum bake

http://www.hellerindustries.com/search.php?zoom_query=Pressure+curing+vs+Vacuum+bake&zoom_page=24&zoom_per_page=10&zoom_and=0&zoom_sort=2

Pressure curing vs Vacuum bake Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO Global Network Americas Asia Africa Australia & New Zealand Europe Inquiry » Search Heller Industries » Pressure curing vs Vacuum bake Pressure curing vs Vacuum bake Enter one or more keywords to search for. Note that '*' and '?' wildcards are supported. Match: any search words all search words Search results for: Pressure curing vs Vacuum bake No results found containing all search terms with sufficient force to be created during reflow in the case of an ders with different melting points can be pop components out of place. uneven deposition of paste on the pads. used . (Encourage a " Bake Off" vs . the competitors) Low Mass Coil Heaters give instant response to load and profile changes for superior repeatability

Pressure curing vs Vacuum bake

http://www.hellerindustries.com/search.php?zoom_query=Pressure+curing+vs+Vacuum+bake&zoom_page=1&zoom_per_page=10&zoom_and=0&zoom_sort=1

Pressure curing vs Vacuum bake Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO Global Network Americas Asia Africa Australia & New Zealand Europe Inquiry » Search Heller Industries » Pressure curing vs Vacuum bake Pressure curing vs Vacuum bake Enter one or more keywords to search for. Note that '*' and '?' wildcards are supported. Match: any search words all search words Search results for: Pressure curing vs Vacuum bake No results found containing all search terms & mechanical seal Vacuum Module Option Vacuum Module( Optional) Vacuum pump Gauge Vacuum in/out line ... 5 Jul 2016   -   URL: http://www.hellerindustries.com . Gives lowest T's even on heavily loaded PCB's. (Encourage a " Bake Off" vs . the competitors) Low Mass Coil Heaters give instant response to load and profile changes for superior repeatability

Baking Dry Cabinets-Quality Baking Dry Cabinets Source|1clicksmt.com

https://www.1clicksmt.com/products/baking-dry-cabinets.html

? If so ,please fill out the form below and representative will contact you. You are here: DRYING CABINETS > Baking Dry Cabinets > Overview Baking Dry Cabinets Desktop Drying Oven series RT+10~250 ℃ 2 Shelves per chamber or specify Compact, versatile forced convection system with , 'hot bake' function and large viewing window Details RT+10~250 ℃ 2 Shelves per chamber or specify Compact, versatile forced convection system with , 'hot bake' function and large viewing window Click For Price More Product Info Vertical Drying Oven Series RT+10~250℃ / 10~300 ℃ option Bigger capacity and more shelves Compact, versatile forced convection system with , 'hot bake' function and large viewing window Details RT+10~250℃ / 10~300 ℃ option Bigger capacity and more shelves Compact, versatile forced convection system with , 'hot bake' function and large viewing window Click For Price More Product Info Inquiry

Quality Drying Cabinet, Dry Cabinet Source, Stencil Cleaner Supplier

https://www.1clicksmt.com/products/drying-cabinet.html

? If so ,please fill out the form below and representative will contact you. You are here: DRYING CABINETS > Overview Drying Cabinets Store moisture-sensitive SMDs and boards or reclaim exposed components to eliminate moisture-related defects . Circulation convection heating system. 24 hours real-time monitoring of temperature Click For Price More Product Info Desktop Drying Oven series RT+10~250℃ 2 Shelves per chamber or specify Compact, versatile forced convection system with , 'hot bake' function and large viewing window Details RT+10~250℃ 2 Shelves per chamber or specify Compact, versatile forced convection system with , 'hot bake' function and large viewing window Click For Price More Product Info Vertical Drying Oven Series RT+10~250℃ / 10~300 ℃ option Bigger capacity and more shelves Compact, versatile forced convection system with , 'hot bake' function and large viewing window Details RT+10~250℃ / 10~300℃ option Bigger capacity and more shelves Compact, versatile forced convection system with , 'hot bake' function and large viewing window Click For Price More Product Info Inquiry in × Product Name E-mail Country -- Please Select Country -- Afghanistan Åland Islands Albania Algeria American Samoa Andorra Angola Anguilla Antarctica Antigua

Moisture Sensitive Devices (MSD) Council

https://www.smta.org/msd/msd.cfm

. The industry standards provide a set of guidelines that are notoriously difficult to understand and challenging to implement. Simplified manual procedures tend to err on the conservative side and result in a large number of unnecessary bake cycles . The bag seal date and the 12 months minimum shelf life is not an expiration date. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5 . The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each sensitive components during localized reflow. The default bake cycle for populated boards is 10 days at 90C. Upcoming Events April 6 Webinar: Reflow Simulation – X-ray & Optical Help Solves Design & Process April 6, 2020 April 7 FREE Pre-Conference Webinar - POSTPONED PENDING NEW DATES May 5, 2020 Milwaukee, WI May 12 Medical Electronics Symposium - CANCELLED May 12 - 13, 2020 Cleveland, OH Corporate Member Spotlight: Find out what SMTA means to PAC Mexico... What you are saying: I have found that the SMTA

Moisture Effects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage T

https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101

. In addition, alternate drying and storage conditions for the moisture/reflow sensitive materials will be evaluated and compared with default bake conditions specified in IPC/JEDEC J-STD-033. Key Words : Find out what SMTA means to PAC Mexico... What you are saying: I have found that the SMTA network is filled with passionate industry experts concerned with my success

Unisoft - software CELLS next step builder

http://www.unisoft-cim.com/cells-next-step-builder.html

.  You can create new process routings from scratch or import an existing process routing from CELLS Workflow then modify it and export it out as your new process routing .   You can enter data according to the flow of the process being described rather than entering data directly into the NEXT_STEP table in a fragmented, out-of-order manner.     TABLES .   Examples are BAKE or SOLDER.   While        some actions are built-in, most are defined by the user.     -   The CONDITIONS table describes the outcomes of a step.   An examples is $PASS

Unisoft - software CELLS next step builder

https://www.unisoft-cim.com/cells-next-step-builder.html

.  You can create new process routings from scratch or import an existing process routing from CELLS Workflow then modify it and export it out as your new process routing .   You can enter data according to the flow of the process being described rather than entering data directly into the NEXT_STEP table in a fragmented, out-of-order manner.     TABLES .   Examples are BAKE or SOLDER.   While        some actions are built-in, most are defined by the user.     -   The CONDITIONS table describes the outcomes of a step.   An examples is $PASS

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. Under x-ray inspection you would normally see solder shorts towards the centre of the device. Figure 3 shows the effect of “pop-corning” Fig 3 Blistered component substrate Solution to Problem The solution to this problem is to slowly pre-bake the components and boards prior to reworking them . This will allow any moisture to escape slowly. Some companies already specify this as a pre- requisite before any rework is carried out. Users should also ensure that only correctly stored devices are used for both assembly and rework and these are often out of the control of the rework machine manufacturer. Position of the component on the PCB is a major influence, if a component is placed at the edge of a board, the temperature of the outer 2 sides will generally be greater than the temperature of the inner sides

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. Under x-ray inspection you would normally see solder shorts towards the centre of the device. Figure 3 shows the effect of “pop-corning” Fig 3 Blistered component substrate Solution to Problem The solution to this problem is to slowly pre-bake the components and boards prior to reworking them . This will allow any moisture to escape slowly. Some companies already specify this as a pre- requisite before any rework is carried out. Users should also ensure that only correctly stored devices are used for both assembly and rework and these are often out of the control of the rework machine manufacturer. Position of the component on the PCB is a major influence, if a component is placed at the edge of a board, the temperature of the outer 2 sides will generally be greater than the temperature of the inner sides

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

? You’ll find that out in the next chapter. Solder Ball 3、How to Make a Solder Ball? One of the oldest and widely used solder ball creation methods is the 3-Orifice design . For a wire, cut the wire into tiny pieces, and for a solder sheet, knock out specks. Cut out pieces and specks in measures that will accurately yield the volume of a solder ball with a 2mm diameter . However, the method also comes with its downsides. For starters, the technique can be fraught with contamination and turn out messy. Also, each of the balls will each have a different weight, although you can measure their weights. Also . Moreover, when the board undergoes heating in reflow, these contaminants are forced out. Their abrupt escape shoots gases in all directions and consequentially blows liquid solder across the board . You’ll most likely need to remake the board, as you can’t bake the trapped air away. If paste gasses are jetting off from underneath the board, you can resolve this by reducing the amount of paste

Upcoming Expos

http://smta.org/expos/

. Special Kneads and Treats , a non-profit specialty bake shop, provides free birthday cakes to children in our community that cannot afford them while providing Special Needs adults in the same & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you! The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 Americas Companies in bold are SMTA corporate members Exhibitors The Michigan Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn to be put on a wait list at kaitlyn@smta.org or call 952-920-7682. Thank you! The cost to exhibit is $375/$475 (early/regular :30pm Exhibits Move-Out Wednesday, October 25 from 3:30pm-7:30pm Why Exhibit at IWLPC? * Reach a focused international audience * Generate Exposure in this highly competitive marketplace * Share New Products and concepts to the market * Enhance

Journal of SMT Articles

http://smta.org/knowledge/journal.cfm

, Marie Cole, Jim Wilcox, David Braun Purchase  22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Purchase  22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER . Want to get published? Find out about the review process, paper requirements, and how to submit your paper . Full articles (PDF format) are FREE FOR SMTA MEMBERS to download

Thermotron Temperature Chamber

http://ce-exchange.com/detail/thermotron-temperature-chamber-bake-oven-6108.cfm

-exchange.com Thermotron Temperature Chamber Bake Oven Thermotron Temperature Chamber {ID: 6108} Large cavity baking chamber in good condition CEE ID: 6108 Status: Available Model . CEE's goal is always to minimize your risk.   First Name:   * Last Name:   * Company: Phone: Email:   * As a service to our customers, CEE periodically sends out a newsletter

HELLER

http://islandsmt.com/wp-content/uploads/2017/02/1707EXL-Heller-Manual-680441-ver3.8.pdf

and tolerant of variations in exhaust blower efficiency. As a general guideline, exhaust volume is insufficient if an odor comes out of the oven. If the heaters in the reflow zones are operating above 70% power during production processing, there is too much

IPC-1730A

http://ipc.org/4.0_Knowledge/4.1_Standards/IPC-1730A.dot

Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannot be defended with data Notice IPC Standards and Publications . IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards development process. There are many rounds of drafts sent out for review and the committees spend hundreds of hours in review and development       Auger Analysis       Punchability       Shear Strength       Specific Gravity       Rockwell Hardness Oven Bake Thermal Stress                                                       PREPREG TEST SITE CAPABLE Visual Surface Inspection       Dimensional

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